UNIVERSAL BONDING COMPOUND View larger

UNIVERSAL BONDING COMPOUND


For direct bonding plasterboards to masonry walls

For direct bonding plasterboards to masonry walls : plasterboard, polystyrene, glass wool.

BENEFITS

• Bonds to the majority of masonry substrates
• Easy to mix and apply
• Dabs are quickly applied and allows adjustment during boarding
• Capable of accom- modating nominal background irregularities
• Hand use

 
UNIVERSAL BONDING COMPOUND
TECHNICAL DEFINITION

UNIVERSAL BONDING COMPOUND is an Gypsum based adhesives for interior fixing of plasterboard with or without insulation.

Also allows filling of gaps between boards.


COMPOSITION AND APPEARANCE

Plaster-based powder filler, containing calcium carbonate and various additives.

The mix obtained is white.


COVERINGS

Any type of plasterboard with paper face, with or without insulation (glass wool, rock wool, polystyrene).

• Concrete
• Cement filler
• Render
• Cellular concrete
• Clay brick


TECHNICAL CHARACTERISTICS

• Setting time : 2 hours

• Adherence on concrete : > 1 MPa

• Adherence on polystyrene : breakage of polystyrene

• A1 class reaction to fire


REFERENCE DOCUMENTS

DTU 25.41 and 25.42.

DoP.

CE marking.

Standard EN 14496.


PACK SIZE

25 kg bags.


STORAGE

9 months in unopened original packing if kept away from damp.


APPLICATION

Generally, apply in dabs of approximately 10 cm at horizontal intervals of 30 cm and vertical intervals of 40 cm.

For insulation containing fibre (glass wool, rock wool), apply an initial coat of gypsum based adhésives.

ISOCOL MORTAR is then applied in dabs to this line of filler.

The surface glued up after applica- tion of the panel should correspond to around 15 % of the overall panel surface.


DRYING TIME

UNIVERSAL BONDING COMPOUND is hard in 2 to 3 hours. Complete drying requires 24 hours.


AMOUNT REQUIRED

From 1.5 to 3 kg/m2 depending on number and thickness of dabs.


RECOMMENDED APPLICATION

To bond curved panels, do not hesitate to saw into the insulation in places to ensure total contact with the substrate.

 
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